| PART |
Description |
Maker |
| IXGR40N60B2 IXGR40N60B2D1 |
C2-Class High Speed IGBTs (Electrically Isolated Back Surface)
|
IXYS Corporation
|
| DESC29-06AC |
HiPerFRED Epitaxial Diode ISOPLUS220 Electrically Isolated Back Surface HiPerFRED外延二极管ISOPLUS220电隔离背
|
IXYS, Corp.
IXYS[IXYS Corporation]
|
| IXGR32N60C |
HiPerFASTTM IGBT Lightspeed Series ISOPLUS247TM package(Electrically Isolated Back Side)
|
IXYS Corporation
|
| IXFR180N085 |
Discrete MOSFETs: HiPerFET Power MOSFETS
HiPerFET-TM Power MOSFETs ISOPLUS247-TM (Electrically Isolated Back Surface)
|
IXYS Corporation
|
| AUIR3241S AUIR3241STR |
high side Mosfet driver for back to back topology targeting back to back switch
|
Infineon Technologies A...
|
| IXGR24N60C |
Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Metal; Series:GT; No. of Contacts:24; Connector Shell Size:24; Connecting Termination:Crimp; Circular Shell Style:Right Angle Plug; Body Style:Right Angle 42 A, 600 V, N-CHANNEL IGBT
HiPerFASTTM IGBT ISOPLUS247TM (Electrically Isolated Back Surface)
|
IXYS, Corp.
IXYS[IXYS Corporation]
|
| MIC640 |
Interface pour 4 entr?s analogiques sur liaison s?ie
Interface pour 4 entr殄s analogiques sur liaison s轵ie
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| MSS50-800 MSS40 MSS40-1200 MSS40-800 MSS50-1200 MS |
(MSS40 / MSS50) BACK TO BACK SCR MODULE
BACK TO BACK SCR MODULE
|
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
|
| MBR2X050A120 |
Electrically Isolated Base Plate
|
GeneSiC Semiconductor, ...
|
| MWDM1L-GP-0E MWDM2L-GP-0E MWDM4L-GP-0E MWDM5L-GP-0 |
Micro-D Metal Shell MWDM Back-To-Back Unshielded Cable Assemblies
|
Glenair, Inc.
|
